Electronic type: HF; Hydrofluoric Acid
CAS No：7664-39-3
Application: Wet etching and cleaning of silicon wafer in semiconductor and solar cell manufacturing, fpd manufacturing processes such as LCD screen, and crystal oscillator (quartz oscillator) manufacturing processes.
Package: gallon bottle, 20kg, 25kg polyethylene bucket, 200kg pressure container, 1000kg IBC barrel, 20t TANK.
Note: The manufacturing process of semiconductor and FPD increasingly requires refinement and high performance, and the cleaning of semiconductor silicon circuit board becomes very important in various processing processes. Hydrofluoric acid has the characteristics of etching and removing silicon oxide film, so it is also an indispensable fine processing technology in the cleaning process of semiconductor silicon circuit board. As dilute hydrofluoric acid is required for final cleaning in the current multi-stage cleaning process, the wet etching process of semiconductors also requires high cleanliness of hydrofluoric acid. Ultra-high purity hydrofluoric acid is also required to clean equipment components that require high purity of hydrofluoric acid. In addition, in semiconductor and FPD manufacturing processes, ultra-high purity agents can not only remove the oxide film, but also meet various requirements for cleaning and functionality in inhibiting particle adhesion and wafer surface roughness.
chemical.tnj
+8618949823763
tnjchem
2881500864